湿度与水分2010国际会议征文
发布时间：2009年9月1日 13时58分
Joint International Symposium on Temperature, Humidity, Moisture
and Thermal Measurements in Industry and Science
May 31st - June 4th 2010
Portoroz, Slovenia
The International Symposium on Humidity and Moisture (ISHM), and the International Symposium on Temperature and Thermal Measurements in Industry and Science (TEMPMEKO) are the premier international meetings for measurement science and standards, in their respective fields. Recognising the coinciding schedule and strong synergy between the two events, the 6 th ISHM and 11th TEMPMEKO will take place together in 2010 as a joint event, coordinated by the responsible committees, CIPM CCT/WG6 and IMEKO/TC12.
TOPICS
Papers are invited for the following topics in temperature, humidity, moisture and thermal measurements:
Fundamental Aspects and Standards
* Thermodynamic Temperature Determinations
* Temperature Scales
* Fixed Points
* Humidity and Moisture Standards
Standard Reference Materials for Humidity and Moisture Measurements
* Water vapour pressure data
* Interaction of Water Molecules with Gases, Liquids and Solids
* Water activity of substances
* Moisture profile and transport
* Water vapour flux
* Thermophysical Properties
Methods and Sensors
* Thermoelectric Thermometry
* Resistance Thermometry
* Noise Thermometry
* Acoustic Thermometry
* Radiation Thermometry
* Instrumentation
* Hygrometers and Moisture Sensors
Traceability and Dissemination
* Interlaboratory Comparisons
* Calibration Procedures and Facilities
* Uncertainty Estimation
Applications of temperature, humidity, moisture and other thermal measurements
* Control and Automation
* Dynamic and Transient measurements
* Industrial Processing Applications
* Medical and Biological measurements
* Environmental measurements
* Climate and Weather Applications
* Other applied measurements
TIMETABLE AND DEADLINES
Submission of abstracts: 31st October 2009
Notification of acceptance: 15th January 2010
Submission of papers: 28th February 2010
Registration begins: 15th January 2010
CONFERENCE FEES
Conference fee is 550 EUR for early registration by 1st March 2010 and 650 EUR afterwards.
For every 5 paid conference fees from same institution, there is one extra free registration.
Also there is possibility for limited number of student registrations, providing appropriate proofs, with 50 % discount (275 EUR and 325 EUR).
Registration Includes:
Welcome Party (Sunday Evening)
Cultural visit
Monday to Thursday Meals
- Buffet Lunch
- Dinner
- Morning and Afternoon Coffee Breaks
Program booklet with abstracts.
ADDITIONAL INFORMATION
Official website: http://www.tempmeko-ishm.org
Instruction for authors: http://www.tempmeko-ishm.org/authors.html
Email: info@tempmeko-ishm.org
tel. +386 1 4768 224; +386 1 4768 798
fax. +386 1 4264 633
Address:
TEMPMEKO&ISHM 2010
University of Ljubljana
Faculty of Electrical Engineering
Laboratory of Metrology and Quality
Trzaska 25
1000 Ljubljana
Slovenia
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